elemelt™ 2975-N Polyolefin Natural

elemelt™ 2975-N Polyolefin Natural is an FDA-compliant propylene homopolymer resin designed for low pressure molding. This resin has the characteristics of a short open time with a high melting point, has excellent chemical resistance and superior adhesion properties. Application temperature is 180-210°C which is ideal for PCB encapsulation and durability. Adhesion can be further improved with plasma treating or by coating chemical primer. Compatible with Mold Man® 10506000, 6200, 8000, and 8200.

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Models

2975-N

Applications

Polyamide alternative
PCB encapsulation

Specifications

Melt Viscosity 23,000 @ 163 ºC
11,000 @ 177 ºC
8,000 @ 190 ºC
6,000 @ 204 ºC
Needle Penetration 10 1/10 mm @ 25 ºC
Tensile Strength 2.56 MPa @ 23 ºC
Softening Point by Ring & Ball 157 ºC
Shear Adhesion Failure Temperature (SAFT) 139 ºC
Glass Transition -20 ºC
Open Time 0 s @ 25 ºC
Flash Point >235 ºC
Solid Density 0.86 g/cc @ 25 ºC
Melt Density 0.74 g/cc @ 190 ºC