Polyamides

elemelt™ SP Series Polyamides

elemelt™ SP Series Polyamides are high molecular weight resins designed for low pressure molding. This resin has the characteristics of a high softening point and excellent adhesion to multiple substrates. Adhesion can be improved with plasma treating or by using chemical primer. Compatible with Mold Man® 1050, 6000, 6200, 8000, and 8200.

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ModelsColorViscositySoftening PointWorking TemperatureElongationTensile StrengthAcid ValueAmine ValueSpecific GravityDocuments
SP-92-180-AAmber3,000 to 4,000180 to 190 °C-30 to 150 °C500%90 kgf/cm^210 max1 max1.0SDSTDS
SP-92-180-BBlack3,000 to 4,000180 to 190 °C-30 to 150 °C500%90 kgf/cm^210 max1 max1.0SDSTDS
SP79-160-AAmber2,000 to 5,000160 ± 5 °C-20 to 130 °C400%120 kgf/cm^210 max2 max1.01SDSTDS
SP79-160-BBlack2,000 to 5,000160 ± 5 °C-20 to 130 °C400%120 kgf/cm^210 max2 max1.01SDSTDS

 

Henkel Polyamides

Henkel Loctite Technomelt® PA Series Polyamides

Henkel Loctite Technomelt® PA Series Polyamides are high-performance thermoplastics that can be processed at low processing pressure due to their low viscosity, allowing encapsulation of fragile components without damage. Produces no toxic fumes in process and provides a good balance of low and high temperature performance. Compatible with Mold Man® 1050, 6000, 6200, 8000, and 8200.

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ModelsColorElongationHardnessSoftening PointViscosityDocuments
PA6208Amber600%82 A150 to 160 °C3,600 cP @ 210 °CSDSTDS
PA6208SBlack450%82 A150 to 160 °C3,600 cP @ 210 °CSDSTDS
PA633Amber400%90 A170 to 180 °C3,500 cP @ 210 °CSDSTDS
PA638Black400%90 A170 to 180 °C3,500 cP @ 210 °CSDSTDS
PA641Amber400%92 A170 to 180 °C4,500 cP @ 210 °CSDSTDS
PA646Black800%92 A170 to 180 °C4,500 cP @ 210 °CSDSTDS
PA652Amber400%77 A157 to 165 °C4,000 cP @ 210 °CSDSTDS
PA657Black400%77 A157 to 165 °C4,000 cP @ 210 °CSDSTDS
PA673Amber400%88 A150 to 160 °C3,400 cP @ 210 °CSDSTDS
PA678Black400%88 A150 to 160 °C3,400 cP @ 210 °CSDSTDS
PA668White600%90 A155 °C5,500 cP @ 210 °CSDSTDS