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elemelt™ TC Series Copolyesters

MoldMan Systems™ has its own line of copolyesters under the name elemelt™. Designed for use in low pressure molding applications, elemelt™ TC Series Copolyesters provide an alternative to polyamides where solvent resistance, high adhesion, elasticity and memory retention are required.

TC Series Copolyesters have a high molecular weight, short open time, and a high melting point. Application temperature is 180-210°C which is ideal for PCB encapsulation and durability. Compatible with Mold-Man® 1050 and 8200.

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ModelsColorMelting PointViscosityAcid ValueSpecific GravityWater AbsorbtionApplication TemperatureDocuments
TC-960-0R02-BBlack160 to 170 °C200 to 300 dPa @ 220 °C3 max1.110.4% (RH 23 °C 50%, 1 Day)180 to 210 °CSDSTDS